DaftarIsitemplate |
Call Number |
621.381 Hwa m |
Title |
Modern solder technology for competitive electronics manufacturing/Jennie S. Hwang |
Author |
Hwang, Jennie S.; |
Publisher |
New York, NJ McGraw-Hill 1996 |
Subject |
Electronic packaging; Solder and soldering |
Location |
FASILKOM-UI; |